| Titre : |
Numerical simulation of compression molding of UHMWPE : Part II. Residual stress model |
| Type de document : |
texte imprimé |
| Auteurs : |
N. C. Parasnis, Auteur ; K. Ramani, Auteur |
| Année de publication : |
2000 |
| Article en page(s) : |
p. 194-201 |
| Note générale : |
Bibliogr. |
| Langues : |
Anglais (eng) |
| Index. décimale : |
668.9 Polymères |
| Résumé : |
Molding - In part I of this paper a thermal model was used for temperature predictions within a compression molded disc. A process simulated laminate technique was used to measure residual stresses. The fast cooling cycle produced high residual stresses (∼;10 MPa). The slow cooling cycle produced low residual stresses (∼;1 MPa). The cycle with soak at crystallization also produced low residual stresses (∼;2.6 MPa). The modeled and measured values were in close agreement. A major portion of the residual stresses (∼;70%) was developed within a short time period (∼;10 min) after the end of crystallization for all the cycles. |
| DOI : |
10.3139/217.1585 |
| En ligne : |
https://drive.google.com/file/d/166k5i4-Kp8M3jxWL5KduDYu0O9EU-Gd1/view?usp=drive [...] |
| Format de la ressource électronique : |
Pdf |
| Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=16062 |
in INTERNATIONAL POLYMER PROCESSING > Vol. XV, N° 2 (06/2000) . - p. 194-201
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Numerical simulation of compression molding of UHMWPE in INTERNATIONAL POLYMER PROCESSING, Vol. XV, N° 2 (06/2000)
