Powder coating advances for edge corrosion protection / Kathryn Shaffer in COATINGS WORLD, Vol. 24, N° 5 (05/2019)  

[article]  inCOATINGS WORLD > Vol. 24, N° 5 (05/2019) Titre : Powder coating advances for edge corrosion protection Type de document : texte imprimé Auteurs : Kathryn Shaffer, Auteur ; John Schneider, Auteur ; Holli Gonder, Auteur ; Cassandra Allen, Auteur ; Shawn Flegm, Auteur ; Lan Deng, Auteur ; Brian Woodworth, Auteur ; Susan Miller, Auteur Année de publication : 2019 Langues : Américain (ame) Catégories : Anticorrosifs Anticorrosion Bordures Essais de brouillard salin Métaux -- Revêtements protecteurs Poudres métalliques Revêtement poudre -- Additifs:Peinture poudre -- Additifs Revêtements organiques Revêtements poudre:Peinture poudre Index. décimale : 667.9 Revêtements et enduits Résumé : Sharp edge coverage is a huge challenge for the coatings industry. The lack of coverage on sharp edges can compromise a coating’s performance. One of the major failures is rust/corrosion resulting from these exposed edges. Several approaches exist as solutions, both from the manufacturing standpoint and from a coatings/technical perspective. A well-known strategy in manufacturing involves the rounding off of sharp edges on parts prior to coating application. However, this adds significant cost from the manufacturing side. From the coatings standpoint, two-coat systems are the standard for many customers, but this requires two separate oven bakes, adding complexity to the process. This under layer doesn’t always apply at appropriate thicknesses that result in any true protection of those areas. Dry-on-dry approaches remove the double-bake complexity, but the performance hasn’t been found to be a match to the two-bake process. Furthermore, the difficulty in applying dry-on-dry technology makes it a less attractive choice. It is evident that innovation opportunities exist in improving on high-edge coverage. Our team has developed a new, one-coat, direct-to-pretreated metal powder innovation which exceeds the corrosion protection performance of current technologies. This paper provides an overview of our approach toward the development of this new product. Note de contenu : - The Challenge of Edge Protection - Getting the Powder to the Edges - Keeping the Powder at the Edge - Fig. 1 : Maximizing powder coverage at the edges is a challenge for both liquid and powder thermoset systems. Pull-back of paint during the cure cycle further exposes these sharp edges - Fig. 2 : Increased viscosity of high-edge formulation (orange dots) improves the ability of the coating to remain on the edge during the cure cycle - Fig. 3 : Salt spray results for a standard powder formulation and one modified for edge-protection. Significant performance improvement is evident in the high-edge formulation - Fig. 4 : 40 Cycles CCT (SAEJ2334) of a high-edge powder formulation along with our standard powder control on laser-cut iron phosphate pretreated hot-rolled steel - Fig. 5 : 1000 hour salt spray data on actual powder line-applied parts. Even on a large application line, the improvement in edge film build is greatly improved based on this long-range test data - Fig. 6 : The SEM images shown here portray a 40% increase in sharp edge coverage for our high-edge formulation versus the standard powder production control part - Fig. 7 : These SEM images demonstrate the high-edge formulation’s ability to cover even highly ragged, burred edges - Fig. 8 : Shown is an example of line coated parts at a customer trial, this time over primer, another great example for our high-edge powder and its ability to overcome transfer efficiency and flow issues and build film - Fig. 9 : Shown is an example of line coated parts at a customer trial, this time over primer, another great example for our high-edge powder and its ability to overcome transfer efficiency and flow issues and build film En ligne : https://www.coatingsworld.com/issues/2019-05-01/view_technical-papers/powder-coa [...] Format de la ressource électronique : Html Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=32511 [article]

Exemplaires

Code-barres	Cote	Support	Localisation	Section	Disponibilité
aucun exemplaire

PPG Envirocron extreme protection edge : a coatings industry innovation in POLYMERS PAINT COLOUR JOURNAL - PPCJ, Vol. 210, N° 4661 (05/2020)  

[article]  inPOLYMERS PAINT COLOUR JOURNAL - PPCJ > Vol. 210, N° 4661 (05/2020) . - p. 39-40 Titre : PPG Envirocron extreme protection edge : a coatings industry innovation Type de document : texte imprimé Année de publication : 2020 Article en page(s) : p. 39-40 Langues : Anglais (eng) Catégories : Bordures Essais de brouillard salin Revêtements organiques Revêtements poudre Index. décimale : 667.9 Revêtements et enduits Résumé : Covering sharp edges has always been a considerable challenge for the coatings industry. Existing coatings struggle to maintain a uniform layer of protection on a sharp edge throughout the curing process, especially those that have edges cut on steel. This lack of uniformity on sharp edges can compromise a coatings performance and lead to deterioration. Rust and corrosion along these exposed edges continues to be a significant issue, prompting a need for innovation in the coatings industry. Note de contenu : - Fig. 1 : Maximising powder coverage at the edges is a challenge for both liquid and powder thermoset systems. Pull-back of paint during the cure cycle further exposes these sharp edges - Fig. 2 : Example of line-coated parts at a customer trial, this time over primer, another instance of PPG's high-edge powder and its ability to overcome transfer efficiency and flow issues and build film - Fig. 3 : 1000hr sait spray data on actual powder line-applied parts. Even on a large application line, using Envirocron, the improvement in edge film build is greatly improved based on this long-range test data - Fig. 4 : These SEM images demonstrate Envirocron high-edge formulation's ability to cover highly ragged, burred edges - Fig. 5 : Salt spray results fora standard powder formulation and one modified for edge-protection. Significant performance improvement is evident in the high-edge formulation when using Envirocron En ligne : https://drive.google.com/file/d/1J27t2NmA_wr9xL_qfW3nkrPcOj72ucM1/view?usp=drive [...] Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=34250 [article]

Réservation

Réserver ce document

Exemplaires (1)

Code-barres	Cote	Support	Localisation	Section	Disponibilité
21744	-	Périodique	Bibliothèque principale	Documentaires	Disponible

Reliably reinforcing ball grid arrays while minimizing stress on solder joints / Markus Schindler in ADHESION - ADHESIVES + SEALANTS, Vol. 20, N° 2/2023 (2023)  

[article]  inADHESION - ADHESIVES + SEALANTS > Vol. 20, N° 2/2023 (2023) . - p. 13-16 Titre : Reliably reinforcing ball grid arrays while minimizing stress on solder joints Type de document : texte imprimé Auteurs : Markus Schindler, Auteur Année de publication : 2023 Article en page(s) : p. 13-16 Langues : Multilingue (mul) Catégories : Adhésifs dans les équipements électriques/électroniques Assemblages collés Bordures Circuits intégrés Index. décimale : 668.3 Adhésifs et produits semblables Résumé : No one likes stress. But stress is not just unpleasant for people ; it can also have negative effects on increasingly complex chip packages soldered onto circuit boards as integrated functinal units. Processes such as capillary underfill, corner fill, or edge bond are suitable for reinforcing these assemblies onto boards. Edge bond in particular is less likely to put stress on the component, extends the service life of the packages, and simplifies reworkability. Note de contenu : - First "Moore's law", now "more than moore" - Larger assemblies with increased functional density - Capillary underfill for reinforcing BGAs - Edge bond as a stress-free reinforcement - Corner fill as another option for reinforcing complex packages - Fig. 1 : Warpage of a package due to the difference in thermal length expansion of different materials - Fig. 2 : UV-curing edge bond on a test component and micrograph : edge bond only wets the flank and does not run under the package. No solder joint is bonded, which significantly simplifies any rework - Fig. 3 : Schematic of the test circuit where resistance is measured and the recorded measured resistance under stress (in this example, thermal shock) for several test setups - Fig. 4 : In the case of heat curing, the stress-free state of the adhesive is at the curing temperature (e.g., 100 °C), which means stresses are formed at room temperature and UV curing defines the stress-free state at room temperature - Fig. 5 : Edge bond, corner fill and capillary underfill. Three different reinforcement options for chip packages on boards. Areas where the adhesive is applied are marked in pink En ligne : https://drive.google.com/file/d/1b_F5OtDGyryUj_16v51AuPg0NXYhvQ5_/view?usp=drive [...] Format de la ressource électronique : Pdf Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=39389 [article]

Réservation

Réserver ce document

Exemplaires (1)

Code-barres	Cote	Support	Localisation	Section	Disponibilité
23963	-	Périodique	Bibliothèque principale	Documentaires	Disponible

---

1 (1 - 3 / 3)