Titre : |
Dispensing for Large-Scale Composites : Advancements in novel pumping technology for paste adhesives are successfully addressing the challenges of large scale composite industrialization |
Type de document : |
texte imprimé |
Auteurs : |
Mac Larsen, Auteur |
Année de publication : |
2011 |
Article en page(s) : |
p. 30-33 |
Langues : |
Américain (ame) |
Catégories : |
Adhésifs -- Appareils et matériel Adhésifs -- Applications industrielles Assemblages collés Composites -- Collage Coques (architecture navale) Eoliennes Mélanges (chimie)
|
Index. décimale : |
668.3 Adhésifs et produits semblables |
Résumé : |
The joining together of large structures such as wind turbine blades or ship hulls strictly with adhesives (vs. mechanical fastening techniques) has become a common practice. The current challenge is how to bring the adhesive bonding process into a mainstream operation that increases production throughput while maintaining control and minimizing manufacturing costs.
Many factors need to be addressed when scaling up the bonding process, not the least of which is the question of how to reliably dispense thousands of pounds of adhesive each day, with minimal waste. Advancements in novel pumping technology for paste adhesives are successfully addressing the challenges of large-scale industrialization by quickly and reliably meter-mixing significant volumes of reactive two-component adhesives. The reactive mix is then directly dispensed to bond lines hundreds of meters long or manually pumped into buckets for manual application. |
Note de contenu : |
- Properties of paste adhesives
- Mix ratio
- A/B mix quality
- Flow rate
- Bulk supply
- Mobility
- Ease of use and maintenance
- Increasing industrialization |
En ligne : |
http://www.adhesivesmag.com/Articles/Feature_Article/BNP_GUID_9-5-2006_A_1000000 [...] |
Format de la ressource électronique : |
Web |
Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=11938 |
in ADHESIVES & SEALANTS INDUSTRY (ASI) > Vol. 18, N° 7 (07-2011) . - p. 30-33