Titre : |
Adhesive characterization using NIAR-modified KGR extensometer |
Type de document : |
texte imprimé |
Auteurs : |
W. P. Seneviratne, Auteur ; J. S. Tomblin, Auteur |
Année de publication : |
2011 |
Article en page(s) : |
p. 37-44 |
Note générale : |
Bibliogr. |
Langues : |
Américain (ame) |
Catégories : |
Assemblages collés Caractérisation Cisaillement (mécanique) Colles:Adhésifs Contraintes (mécanique) Extensomètre Mesures physiques
|
Index. décimale : |
668.3 Adhésifs et produits semblables |
Résumé : |
ASTM standard test medhod for thick-adherend metal lap-shear joints for determination of the stress-strain behavior of adhesives in shear by tension loading (D5656) recommends using a KGR extensometer, specially designed to measure the shear deformation of the gage section of single lap or double lap shear specimens. The KGR extensometer is a customade unit that comes with its own signal conditioner. ASTM D5656 is the only currently available standard method generate adhesive shear stress-strain curves that are widely used in the industry for adhesive joint designs. Therefore, the authors have develoed the proposed technique to measure the shear strain for ASTM D 5656 specimens. The NIAR-KGR extensometer method does not require special signal conditioning or specialized extensometers that are limited to use in ASTM D5656 testing. A standard laboratory axial extensometer can be converted to a NIAR-KGR extensometer with the use of the specially designed attachments discussed in thie paper. THE NIAR-KGR technique has no usage limitations for thick bondlines, and test data has been generated for bondline thicknesses up to 5 mm. The use of the NIAR-KGR techynique does not require significant changes to the overall data reduction methodology. The adhesive characteristics generated using the attachments are in several technical reports and publications. Tests results produced using the NIAR-KGR method were comparable to adhesive strain-strain curves obtained using KGR extensometer data. |
Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=11843 |
in SAMPE JOURNAL > Vol. 47, N° 5 (09-10/2011) . - p. 37-44