Titre : |
Photosensitive polymers |
Type de document : |
texte imprimé |
Auteurs : |
Shilpi Sanghi, Auteur ; Atri Rungta, Auteur |
Année de publication : |
2005 |
Article en page(s) : |
p. 37-50 |
Note générale : |
Bibliogr. |
Langues : |
Anglais (eng) |
Index. décimale : |
667.9 Revêtements et enduits |
Résumé : |
Photoresists are photosensitive polymers undergoing a change in chemical solubility on exposure to UV light. In positive photo resists, UV light exposure leads to scission and increases the solubility (e.g. Novolak) whilein negative photo resists it leads to cross linking of exposed areas thereby decreasing the solubility. Most of negative photo resists are based on cinnamatic derivatives of polymers having hydroxyl groups. Use of appropriate photosensitizers augments the photo resist property. In chemically amplified two or three component based photo resists, Photo acid generator (PAG) is used which acts as a catalyst. Polymers with pendant carboxyl groups with PAG give a negative tone photo resist. Copolymer containing (+) Bornyl Methacrylate and their Racemate is used as +ve tone photoresist. Substituted DOS and MNDDS resin form a positive photoresist. Photoresists are extensively used in lithographic applications. They are used for fabrication of solid devices to protect the underlying substrate for variety of purposes. Offset lithographic printing is used extensively. Various resins used for this process are discussed. |
Note de contenu : |
- Photoresist polymers
- Negative photoresist
- Chemical amplification
- Polymers with pendant carboxyl group
- Copolymers containing (+)-bornyl methacrylate and their racemate used as positive tome photoresist
- Derivative of diphenylamine-4-diazonium salt (DDS) and resin (DDS resin) as negative photoresist
- Offset lithographic printing - The offset lithographic process - Principle of offset printing - Resins - Natural resins - Rosin - Synthetic resins - Alkyd resins - Polystyrene resins and copolymers - Silicne resins - Hydrocarbon resins |
Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=11645 |
in PAINTINDIA > Vol. LV, N° 7 (07/2005) . - p. 37-50