Titre : |
Ti substituted nano-crystalline Cu3N thin films |
Type de document : |
texte imprimé |
Auteurs : |
A. Rahmati, Auteur ; H. Bidadi, Auteur ; K. Ahmadi, Auteur ; F. Hadian, Auteur |
Année de publication : |
2011 |
Article en page(s) : |
p. 289-297 |
Note générale : |
Bibliogr. |
Langues : |
Américain (ame) |
Catégories : |
Couches minces Matériaux nanocristallins Nitrure de cuivre Revêtement métallique
|
Index. décimale : |
667.9 Revêtements et enduits |
Résumé : |
Ti:Cu3N thin films were deposited on Si(111), quartz, and glass slide substrates by DC magnetron sputtering in molecular nitrogen ambient. The structural properties of Ti:Cu3N thin films were studied by X-ray diffraction (XRD) analysis. XRD measurements show diffraction band with peaks close to the (100) and (200) diffraction lines of cubic anti-ReO3 structure of Cu3N. The Ti:Cu3N nano-crystalline size is in the range 22–27 nm. Lattice constant expansion reflects Ti incorporation causing the excess nitrogen to occur. Surface morphology shows that the N richness suppresses the grain growth. The optical absorption spectra indicate a remarkable shift to higher energies of the absorption edge due to higher N concentration and quantum size effect. Photoluminescence (PL) measurement shows interstitial N excess and Ti impurity produce shallow and deep levels, respectively. Thermal stability of the Ti:Cu3N films annealed at 300 and 400°C is improved in comparison with that of Ti free Cu3N films. |
Note de contenu : |
Structural properties - Surface morphology - Chemical composition - Optical properties - Electrical properties - Thermal stability. |
DOI : |
10.1007/s11998-010-9279-9 |
En ligne : |
https://link.springer.com/content/pdf/10.1007%2Fs11998-010-9279-9.pdf |
Format de la ressource électronique : |
Pdf |
Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=11431 |
in JOURNAL OF COATINGS TECHNOLOGY AND RESEARCH > Vol. 8, N° 2 (03/2011) . - p. 289-297