| Titre : |
Haste does not always make waste : High-speed production and recycling requirements are increasing the usage of hot melt adhesives |
| Type de document : |
texte imprimé |
| Auteurs : |
Sharf U. Ahmed, Auteur |
| Année de publication : |
1999 |
| Article en page(s) : |
p. 34-41 |
| Note générale : |
Bibliogr. |
| Langues : |
Américain (ame) |
| Catégories : |
Adhésifs -- Recyclage
Adhésifs repulpables
Adhésifs thermofusibles
Fragmentation
|
| Index. décimale : |
668.3 Adhésifs et produits semblables |
| Résumé : |
The use of hot melt is growing every day, and their advantages have been well-documented. They are becoming more desirable because of their ability to meet new technical and environmental requirements like high-speed production and a solvent-free environment.
However, waste minimization, increased recycling of papers and changing technology are creating a demand for hot melt adhesives with recyclable and repulpable properties. Conventional hot melt adhesives generally have limitations related to recycling and repulping processes as they form water insoluble gummy masses called "stickies" during these operations.
Conventional hot melt adhesives not only form "stickies" during repulping operations, but also cause problems in removing labels during the recycling of packages and containers.
Since the majority of hot melt adhesives are made from hydrophobic polymers, waxes and resins, they are difficult to remove during the repulping and recycling operations. Therefore, there is a strong need for adhesives that will not interfere with the repulping and recycling of waste materials containing hot melt adhesives. |
| Note de contenu : |
- Repulpable adhesives
- Water soluble/dispersible polymers
- Packaging applications
- Multi-wall bag adhesives
- Re-moistenable adhesives
- Adhesives for temporary bonding
- Repulpability test |
| En ligne : |
https://drive.google.com/file/d/1HpctJ7bpdFeCuZ1XvKha0V6np-WNnzj7/view?usp=drive [...] |
| Format de la ressource électronique : |
Pdf |
| Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=20085 |
in ADHESIVES AGE > Vol. 42, N° 8 (08/1999) . - p. 34-41
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