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Achieving high service temperatures with thermoplastic elastomers / R. Himes in ADHESIVES AGE, Vol. 40, N° 4 (04/1997)
[article]
Titre : Achieving high service temperatures with thermoplastic elastomers Type de document : texte imprimé Auteurs : R. Himes, Auteur ; D. R. Hansen, Auteur ; D. L. Shafer, Auteur ; S. L. Fulton, Auteur Année de publication : 1997 Article en page(s) : p. 28-32 Note générale : Bibliogr. Langues : Américain (ame) Catégories : Adhésifs thermofusibles
Copolymère styrène-éthylène-butadiène
Copolymères séquencés
Elastomères thermoplastiques
Ether de polyphénylène
Faisceaux électroniques
Formulation (Génie chimique)
Mastics thermofusibles
Matières premières
Réticulation (polymérisation)Index. décimale : 668.3 Adhésifs et produits semblables Résumé : Styrenic block copolymers are quite useful in many adhesive applications. They can be processed as hot melts at high line speeds or as high solids solution coatings. The thermoplastic nature of the styrene endblocks allows the reversible transition from rigid, reinforcing "physical crosslinks" to a soft, easy processing polymer.
At temperatures below the glass transition ([T.sub.g]) of the styrene domains (approximately 95°C), the copolymers exhibit properties of a reinforced vulcanized elastomer with tensile strengths up to 35 Mpa in the neat form. At temperatures above the polystyrene Tg, the network weakens and flow is possible. Thus, most styrenic block copolymer adhesive formulations are limited to service temperatures of [less than or equal to] 90°C.
Improvements to the service temperature of styrenic block copolymers have been made by electron beam or UV crosslinking star type block copolymers (1). However, not every application can utilize this technique. Many applications, such as automotive or construction applications, would benefit from adhesives which can be hot melt or solvent applied but which have upper service temperatures in the 100-150 [degrees] C range. Blending with endblock compatible resins is a potential approach. However, most conventional end-block resins cannot raise the glass transition temperature of the styrene endblocks because they have Tgs around the same value as polystyrene.
Polyphenylene ether is one of the few polymers that is compatible with polystyrene (2) and that has a glass transition temperature in the range of 130°C to 214°C depending upon the molecular weight (Table I). Adding polyphenylene ether to styrenic block copolymers has been considered before (3, 4, 5, 6), but it has been difficult to commercially practice because of the high viscosities and because of the required high processing temperatures.
A new low molecular weight polyphenylene ether, which may be available soon in developmental quantities, shows great promise for easy incorporation into SEBS (styrene-ethylene/butylene-styrene) adhesive systems to significantly increase the service temperature properties.Note de contenu : - Polyphenylene ether
- Materials evaluated
- Formulations
- Service temperature results
- Lower viscosity TPEs
- Endblock ReinforcingEn ligne : https://drive.google.com/file/d/1Z_7h7jHiKKwek8tw5S8ke7prAnG6Htqy/view?usp=drive [...] Format de la ressource électronique : Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=20390
in ADHESIVES AGE > Vol. 40, N° 4 (04/1997) . - p. 28-32[article]Exemplaires (1)
Code-barres Cote Support Localisation Section Disponibilité 001074 - Périodique Bibliothèque principale Documentaires Exclu du prêt Reshaping adhesive and sealant formulation strategies / Ken Thomas in ADHESIVES & SEALANTS INDUSTRY (ASI), Vol. 24, N° 10 (10/2017)
[article]
Titre : Reshaping adhesive and sealant formulation strategies : A new organic/inorganic composite powder simultaneously simplifies formulas and improves product performance, manufacturing operations, and economics Type de document : texte imprimé Auteurs : Ken Thomas, Auteur Année de publication : 2017 Article en page(s) : p. 21-25 Langues : Américain (ame) Catégories : Adhésifs sensibles à la pression
Adhésifs thermofusibles
Alliages polymères
Construction -- Matériaux
Elastomères
Formulation (Génie chimique)
Mastics thermofusiblesIndex. décimale : 668.3 Adhésifs et produits semblables Résumé : Adhesive and sealant manufacturers and end users are always looking for a competitive edge. Faced with a bewildering number of formulation choices and risk/reward tradeoffs, they can end up getting left behind as technologies advance, or make a technical or business mistake if they are too aggressive. There are literally hundreds of raw materials to choose from, a long process to validate and verify new ingredients, and precious little time for internally driven product development projects. Note de contenu : - Product characterization
- Hot-melt pressure-sensitive adhesives
- Elastomer compounding
- Figure : Photomicrograph of the material
- Tables : 1. SARA/inorganic composition from product data sheet - 2. Tape property comparisons - 3. Power consumptionEn ligne : https://www.adhesivesmag.com/articles/95809-reshaping-adhesive-and-sealant-formu [...] Format de la ressource électronique : Web Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=29206
in ADHESIVES & SEALANTS INDUSTRY (ASI) > Vol. 24, N° 10 (10/2017) . - p. 21-25[article]Réservation
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Code-barres Cote Support Localisation Section Disponibilité 19263 - Périodique Bibliothèque principale Documentaires Disponible
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Titre : Temperature gauge : Measuring high temperature slump resistance of hot-melt sealants based on styrenic block copolymers Type de document : texte imprimé Auteurs : David J. St. Clair, Auteur Année de publication : 2002 Article en page(s) : p. 27-35 Note générale : Bibliogr. Langues : Américain (ame) Catégories : Copolymères séquencés
Copolymères styréniques
Formulation (Génie chimique)
Mastics thermofusiblesIndex. décimale : 668.3 Adhésifs et produits semblables Note de contenu : - Formulation development
- High-temperature slump
- Crosslinking to improve slump
- Formulation to improve slump
- Dynamic mechanical analysis
- Table 1. Development of hot melt sealant formulations
- Table 2. Effect of crosslinking on slump resistance of hot melt sealants
- Table 3. Effect of endblock resin on slump of sealants containing 20% polymer
- Table 4. Effect of endblock resin on slump of sealants containing 30% polymer
- Table 5. Formulations for weatherable sealantsEn ligne : https://drive.google.com/file/d/1zvCehvPJgaSBiZYz-bBmWjhTTmmXUkNH/view?usp=drive [...] Format de la ressource électronique : Permalink : https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=20023
in ADHESIVES AGE > Vol. 45, N° 8 (08/2002) . - p. 27-35[article]Réservation
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Code-barres Cote Support Localisation Section Disponibilité 001474 - Périodique Bibliothèque principale Documentaires Disponible