[article]
Titre : |
The characteristics of a microcapsule made entirely from a new silicone-resign-polypeptide and its application |
Type de document : |
texte imprimé |
Auteurs : |
Yuka Ueda, Auteur ; Akihiro Segawa, Auteur ; Masato Yoshioka, Auteur |
Année de publication : |
2003 |
Article en page(s) : |
p. 111-116 |
Note générale : |
Bibliogr. |
Langues : |
Anglais (eng) |
Tags : |
Microcapsule 'Absorbeurs UV' Encapsulation Silicone 'Produit de protection solaire' |
Index. décimale : |
668.5 Parfums et cosmétiques |
Résumé : |
A new method was developed to prepare microcapsules involving hydrophobic components and a totally new silicone-resin-polypeptide material used as the encapsulating body, where the polypeptide was made by hydrolysis of collagen and silk protein combined with silicone. This microcapsule was easily prepared from a silicone-resin-polypeptide in water solution. Not only was the extent of encapsulation in the micro-capsule as high as 90% (which has never been reached) but also the particle size was also homogeneous and could be sufficiently controlled to obtain very small sizes. Moreover, these microcapsules were resistant to relatively high shear forces and were stable over a long time period.
Application in cosmetics by using the UV absorbers (2-ethylhexyl-4-methoxycinnamate (EHMC) and 4-tert-butyl-4'-methoxy-dibenzoylmethane (BMDBM)) as the encapsulated ingredients was examined. Because the polymer acts like as surfactant itself, it was possible to apply organic UV absorbers in water-rich formulations without any surfactant. This formulation demonstrated a good moisturizing and soft skin feel. In addition, since the microcapsules were easily mixed with inorganic compounds like titanium dioxide and zinc oxide, the amount of their dispersants could be reduced to maintain a high SPF value. As a result, it was concluded that such microcapsules might be widely applied in cosmetics. |
Permalink : |
https://e-campus.itech.fr/pmb/opac_css/index.php?lvl=notice_display&id=10595 |
in IFSCC MAGAZINE > Vol. 6, N° 2 (04-05-06/2003) . - p. 111-116
[article]
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